Hi, Meni,

You may try to change the Nickel layer with Titanium or Cr.

Hope it works!

Best regards,
Fei

2010/5/26, Kabla Meni :
> Hi,
>
> We are looking for a metallization which will be used for ohmic contact to
> polysilicon and will also be compatible with soldering and wire bonding.
>
> Correctly, we are using Aluminum which cannot be soldered. we tested
> Al/Ni/Au but interdifusion during annealing (400C) prevented successful
> soldering.
>
> We also tested Cr/NiCu/Au but the short annealing step required for ohmic
> contact also prevent good solderability.
>
> Does anyone has any suggestions for metallization which could be used for
> ohmic contact to polysilicon and is also compatible with soldering and wire
> bonding?
>
> Thank you,
> Meni Kabla


Fei Wang
______________
Postdoctoral researcher, Dr
MIC - Department of Micro and Nanotechnology
Technical University of Denmark (DTU)
Building 344, 1st floor, Room no. 130
DK-2800, Kgs. Lyngby
Denmark
Tel:  +45 4525 6311
Fax:  +45 4588 7762
Email: fei.wang@nanotech.dtu.dk
       http://www.nanotech.dtu.dk