Hi Darren,

I'd agree with Huihang on not using any glue layer such as HMDS if you want
to have PI peeled off after develop.  You may increase the develop time to
2x or 3x for the same purpose.
Hope this helps,
Paul

> ---------- Forwarded message ----------
> From: Huihang Dong 
> To: 
> Date: Thu, 3 Jun 2010 15:17:49 +0000
> Subject: Re: [mems-talk] P1-2525 remove from Si
> Hi Darren,
>
> I have used PI-2611 for my project.
>
> Don't use any of adhesion promoter before your spinning if you want to
> peel the PI.
>
> After your fabrication steps, you can try some sharp
> tools to remove it from the wafer carefully.
>
> The trick is your device may peel off when ultrasonic or auto washing
> are used.
>
> And be careful when acetone is used  during the fabrication, because
> even well cured PI will absorb small amount of acetone which may peel
> your device off the wafer. This will happen more when any bubble appears
>  on your wafer after the spinning.
>
> Hopefully it will help a little bit.
>
> Huihang
>
> > From: d.alvares@student.unsw.edu.au
> > To: mems-talk@memsnet.org
> > Date: Thu, 3 Jun 2010 10:09:55 +1000
> > Subject: [mems-talk] P1-2525 remove from Si
> >
> > Hi All,
> >
> > Just have a question about removing polyimide from an Si Wafer and wanted
> to know if anyone had experience with this? I would spin and bake the PI on
> the wafer. After fabricating the device I wanted to peel the PI with the
> device of the wafer (so it is on a flexible substrate)
> >
> > Are there any special tricks or rigs that you use?
> >
> > Any help I am sure would be very useful
> >
> > Thanks,
> >
> > Darren Alvares