Andrew, Are you still using indium to mount your wafers in your MBE? I stopped using that method 10 years ago and found VEECO sells wafer holders and custom holders for small pieces. I would think spinning photo resist on your front side and a good bake would provide plenty of front side protection if you still want to do a wet etch. Back when I did 1cm squares, I would use resist on the front and a cotton swab with nitric acid for a quick clean up of the indium. I didn't care about back side damage. Brent Andrew Irvine wrote: > Hi all. > > Anyone out there have to etch indium from the back surface of their GaAs > wafers after MBE growth? > > Any thoughts on how I can do it? > > Boiling conc HCl seems to do half a job (some kind of rough residual > crud left over), and I can't find a suitable way of protecting the > epitaxial surface. > > Yep, I'm asking the growers too! > > Many thanks, > > Andy > > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > >