laser cutting damages the edge of the wafer and the chips break very easily.
Search for a water jet wafer cutting company on the internet or ultrasonic
cutting.  These are more gentile unfortunately they are slow and expensive
which is why do not use them.

In your case you are worrying about the chip surviving and so the expense
may be somewhat irrelevant.


Thomas J. Gentemann
VP of Marketing and Sales
Ph # 510-266-3700
Fax # 510-266-3720
Toll free - 1-800-910-0607
e-mail - tgentemann@ultrasil.com

----- Original Message -----
From: "Hongzhi CHEN" 
To: 
Sent: Tuesday, June 29, 2010 8:16 PM
Subject: [mems-talk] dicing company


> Hello,
>
> I am wondering who knows any company that provides good dicing service
> that can
> cut the chips into a cross shape. (We have a dicing saw, but it can only
> do
> squre or rectanglar shape chips. ) The only thing I know is the laser
> dicing
> that can cut the chips in any shape. Any advice for the choice of cutting
> method
> and company? Thank you.
>
> Sincerely yours,
> CHEN Hongzhi