Hi Daniel,

I am thinking about etching silicon. I know that the Bosch process does
the trick. But I am limited to a standard (selfmade) RIE and only to
both gases. I've tried to "pulse" SF6 and CHF3, i.e. say 7s SF6 and then
2s CHF3 with a silica hardmask. As CHF3 etches the silica very slowly I
thought that might work but I didn't get significant results. I want to
etch a couple of hunderts of microns.

Cheers,
Marcel


D.Grimm@ifw-dresden.de schrieb:
> Hi Marcel,
>
> Which substrate you are thinking of? It is no problem to etch Silicon with
> both gases. For deep trenches you'll need to optimise the conditions. For
> very deep trenches, the Bosch process (specialized RIEs only) might be a
> better hint.
>
> Best
> Daniel