Hi All,

I am using a photoplotted transparency mask to pattern resist for a lift off
process. I have a series of lines I have exposed. See image:
http://yfrog.com/mhimage31np

Looking at the pattern under the microscope indicates that there is no sharp
edge on the corner. I have used AZ6632 positive resist. To me this doesn't look
like it will be successful with lift off.

This lines are smallest to largest 10,20,30..um.

Any suggestions or thoughts on:

-Whether lift off will occur.
-What could be the problem. Resist, Exposure Time, Baking, Proper Contact with
substrate?

Looking forward to hearing from you regarding this.

Cheers,
Darren