Hi everyone,

       I'm working on Cu electroplating to fabricate Cu pad. The 200nm Cu seed
layer is directly sputtered on the silicon dioxide without using adhesion layer.
After about 4 um Cu is electroplated, the Cu is not adhered to the substrate
well, and can peel off very easily. My question is, what kind of material can be
used as the adhesion promotion layer. We have Al, Ti, Ag and Ni in our lab, and
will these metals can act as the adhesion promotion layer? If not, what kind of
material can be used and can be readily removed after the electroplating.
Thanks.

Joe