Rob,

we have been using pyrex wafers up to 5mm in thickness bonded to 4" silicon
wafers as hot embossing masters in the past. The process takes a bit longer,
mainly due to the low thermal conductivity of the pyrex and needs higher
voltages but otherwise there are no fundamental reasons why this should not
work.

With best regards

Dr. Holger Becker
microfluidic ChipShop GmbH
Carl-Zeiss-Promenade 10
D-07745 Jena
Germany
Tel. .+49 (0) 36 41 347 05 80
Fax: +49 (0) 36 41 347 05 90

Geschäftsführerin: Dr. Claudia Gärtner
Sitz der Gesellschaft: D-07745 Jena, Germany
Amtsgericht Jena: HRB 209251
USt.-IdNr.: DE 221812444

-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces+hb=microfluidic-chipshop.com@memsnet.org
[mailto:mems-talk-bounces+hb=microfluidic-chipshop.com@memsnet.org] Im
Auftrag von Robert MacDonald
Gesendet: Donnerstag, 14. Oktober 2010 16:48
An: mems-talk@memsnet.org
Betreff: [mems-talk] pyrex wafer thickness for anodic bonding

Wondering if anyone has any experience anodic-bonding pyrex wafers to
silicon wafers, where the pyrex is thicker than normal.

For a 100mm wafer typical thicknesses I've worked
with are in the 400-600um range. Has anyone had experience working with
wafers 2 or 3 times thicker?

Rob MacDonald
Shearwater Scientific