Hi, dear all,

I am doing copper electroplating on silver seed layer. Since the silver seed
layer is very thin, thus with high resistance, we need 2 ~ 3 minutes of copper
plating with high current density (5 Amps) in order to quickly cover the whole
surface area of the sample before we can reduce the current (1 Amps) for a more
uniform plating. However, we just need a very thin layer of copper. The plating
rate is too high during the high current density period that makes it very hard
to control the thickness of copper film.

I am just wondering if anyone have any idea how to reduce the copper plating
rate without reducing current density.

Any suggestion is sincerely appreciated.

Regards,

Mingke