Hello all,

Doeas anyone have any experience of partially inidized polyimide? I have
been using HD Microsystems PI2545 polyimide and been cutting a few
corners by doing the final cure at 180oC in a nitrogen purged convection
oven. However the PI2545 data sheets says to do a final cure for 1 hour
at 400oC.

In subsequent lithography steps I have used lift-off using acetone and
noted that the polyimide seems to swell in certain sections. After
immersing the sample in acetone for 3 days at room temperature there are
200-300 nm thick ridges visible all over the sample.

Anyone got any thoughts? I can provide more details/pictures if necessary.

Thanks,

James

--
Dr. James Paul Grant
Postdoctoral Research Associate
Microsystems Technology Group
76 Oakfield Avenue Room 205
School of Engineering
University of Glasgow
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