Hello,

We would like to use Ni/Cr/Au metallization to be used for ohmic contact to
polysilicon. Does anyone knows if this stack of layers provides good adhesion to
the polysilicon and prevent diffusion of the Au in the poly?

Any other suggestions?

thanks a lot


Elina Iervolino

PhD student
Delft University of Technology
Office Phone: +31 (0)15-2578040
Web page:www.xensor.nl