Hello,

We would like to use Ni/Cr/Au metallization as ohmic contact to
polysilicon. Does anyone know if this stack of layers provides good adhesion to
the polysilicon and prevent diffusion of the Au in the poly?

Any other suggestions?

thanks a lot

Elina Iervolino

PhD student
Delft University of Technology
Office Phone: +31 (0)15-2578040
Web page:www.xensor.nl