Aha. So what we normally did in our lab was to use the chromium as an
adhesion layer for the photoresist and use the photoresist as the etch
mask. That way we etched down to 300 um in pyrex/borofloat and through
entire 700 um wafers of white crown glass. Might be worth giving it a try.

/Mikael

-----Original Message-----
From: mems-talk-bounces+evander=stanford.edu@memsnet.org
[mailto:mems-talk-bounces+evander=stanford.edu@memsnet.org] On Behalf Of
Xin Yan
Sent: Monday, December 13, 2010 9:54 PM
To: General MEMS discussion
Subject: [mems-talk] Adhesion problem during 7740 glass wafer wet etching
process

the sputtering  is  for  lift off. I'm afraid the Cr could not stand for
enough time, So i do the wet etching before removing the photoresist.
what
about heat the substrate to 80degreeC during sputtering to suppress the
pinhole?

Thank you Mikael