Hi Dave,

I already used an acid zincate process. Minimizing pre-etching I also tried.
Sometimes it works but often the structures peel-of after the Ni-Step. After
succesful plating of  a sample I always have those high ohmic resistances...
And I wonder. Perhaps an oxid grows anywhere between two layers?

Chris

-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces+engel.christian=gmx.de@memsnet.org
[mailto:mems-talk-bounces+engel.christian=gmx.de@memsnet.org] Im Auftrag von
David Roberts
Gesendet: Donnerstag, 17. März 2011 06:12
An: 'General MEMS discussion'
Cc: dave@beakeronastick.com
Betreff: Re: [mems-talk] Electric problem after electroless plating

Hi Chris,

Preparing the aluminum for E-less nickel - Clean, etch, de-ox and zincate
removes a significant amount of aluminum.

If you are using an alkaline zincate, this is definitely your problem.

I recommend minimizing pre-etch and definitely use an acid zincate process.

Regards,
Dave