Hi MEMSer...
    I am try to do bonding Silicon to Silicon with thin E-gun evaporated
7740 glass layer...
    Does anybody have such experience on this? Any suggestions?
    Besides I can't find the target for this process , should I directly cut
the 7740 glass substrate as the target? Would this damage the E-gun chamber?
    Or, any alternatives?
    Thanks a lot,
Best regards,
____________________________________________
Jerry Lee
(Jia-Hong Lee)

Insitute of Applied Mechanics,
National Taiwan University
Taipei, Taiwan, ROC

e-mail:
iamjhlee@email.com
r6543023@gauss.iam.ntu.edu.tw

"Try then error is better than no try"