Hi folks,

I used 10 nm Cr as the adhesion layer between silicon nitride and gold
during e-beam evaporation to make gold bonding pads, well, without
successes... I couldn't bond to it. The metal layer was peeled by my gold
bonding ball. However on the same sample, bonding works with those gold
layer on the silicon substrate. So it seems my Cr doesn't stick Au to
nitride, but it sticks it pretty well to Si.

Any suggestion? To replace Cr by, say Ti? Or thicker Cr?

Thanks.

*  Zou Jie (Jay)
*  Department of Physics
*  University of Florida
*  Email: zoujiepku@gmail.com