You will need a more energetic method than simply rinsing with water.
Something like a high pressure cleaning system an example can be found on
our web site.

Gary Hillman
S-Cubed
PO Box 365
9 Mars Ct.
Montville, NJ 07039
phone 973-263-0640 ex 35
fax 973-263-8888
Check out our web site and Twitter at www.s-cubed.com


-----Original Message-----
From: mems-talk-bounces+garyh=s-cubed.com@memsnet.org
[mailto:mems-talk-bounces+garyh=s-cubed.com@memsnet.org]On Behalf Of
AI?a?R
Sent: Monday, May 30, 2011 10:02 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] dicing problem with silicon wafer


I have a dicing problem question. I do not know where the Pt dust particles
came
from. I believe that they came after we diced the Pt/Ti/SiO2/Si wafer. How
should
we clean the wafer? I was thinking about using excessive use of DI water. Do
you
have a better idea?


Thank you,

Joseph Y. Lee
Senior Engineer
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Corporate Technology Operations Headquarters
Micro Fab Group