Joseph,
               One solution is to make the surface of the wafer hydrophobic
before dicing then the particles do not cling strongly.  A weak water flow can
and should wash the particles of easily.  We can make your wafers hydrophobic
easily and the treatment is only one molecule thick but it survives shipping and
time easily.  Bill Moffat

-----Original Message-----
From: mems-talk-bounces+bmoffat=yieldengineering.com@memsnet.org [mailto:mems-
talk-bounces+bmoffat=yieldengineering.com@memsnet.org] On Behalf Of ???
Sent: Monday, May 30, 2011 7:02 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] dicing problem with silicon wafer

I have a dicing problem question. I do not know where the Pt dust particles came
from. I believe that they came after we diced the Pt/Ti/SiO2/Si wafer.. How
should we clean the wafer? I was thinking about using excessive use of DI water.
Do you have a better idea?


Thank you,

Joseph Y. Lee
Senior Engineer
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Corporate Technology Operations Headquarters Micro Fab Group