This is an interesting solution Bill.  How would you suggest making the
wafers hydrophobic?

Dan

-----Original Message-----
From: mems-talk-bounces+dan.ruiz=honeywell.com@memsnet.org
[mailto:mems-talk-bounces+dan.ruiz=honeywell.com@memsnet.org] On Behalf
Of Bill Moffat
Sent: Tuesday, May 31, 2011 10:18 AM
To: joseph.y.lee@samsung.com; General MEMSdiscussion
Subject: Re: [mems-talk] dicing problem with silicon wafer

Joseph,
               One solution is to make the surface of the wafer
hydrophobic before dicing then the particles do not cling strongly.  A
weak water flow can and should wash the particles of easily.  We can
make your wafers hydrophobic easily and the treatment is only one
molecule thick but it survives shipping and time easily.  Bill Moffat