Hello Bill,

How do you do that? Is there a solvent which can make the wafer hydrophobic?
This seems a good idea.

yours,
Joseph

------- Original Message -------
Sender : Bill Moffat
Date   : 2011-06-01 02:18 (GMT+09:00)
Title  : RE: [mems-talk] dicing problem with silicon wafer

Joseph,
               One solution is to make the surface of the wafer hydrophobic
before dicing then the particles do not cling strongly.  A weak ater flow can
and should wash the particles of easily.  We can make your wafers hydrophobic
easily and the treatment is only one molecule thick but it survives shipping and
time easily.  Bill Moffat

------------------------
Joseph Y. Lee
Senior Engineer
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Corporate Technology Operations Headquarters
Micro Fab Group

TEL: 82-31-300-7331
Mobile: 82-10-3332-1440