Hi all,

It's first time I use Su-8 2010 for a micro-fabrication. Generally speaking,
Su-8 PR has been made me some trouble such as air bubbles appeared when soft
baking, non-uniformity with a non-circular sample. Now, the most difficulty is
Su-8 removal. I have spent over 1 hour to remove Su-8 layer after a Si etching.
The PR layer is about 10 um. I put it in acetone solution with a ultrasound
cleaner for over 1 hr. But I see that there is little Su-8 removed (it made the
solution cloudy). It seems nothing has been changed on the wafer surface.

Please show me your experience on removing this PR!

Thanks,
Aboto