If I am right. Before PR application, the wafers should be primed to
promote the adhesion of the PR.

HDMS is normally used, and the purpose of it is to make the wafer
hydrophobic, which can last for a very long time (up to days). Although
it may not be sufficient enough


On 01/06/2011 00:12, 이요석 wrote:
> Hello Bill,
>
> How do you do that? Is there a solvent which can make the wafer hydrophobic?
> This seems a good idea.
>
> yours,
> Joseph
>

--
Best regards,
Jun Hao

Knowledge Transfer Partnership Associate