durusmail: mems-talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
2011-06-01
2011-06-02
2011-06-10
2011-06-10
2011-06-10
dicing problem with silicon wafer
Bill Moffat
2011-06-10
It may sound like a commercial but be sure to use vacuum vapor prime for HMDS
treatment.  The reason the HMDS treatment lasts is the vacuum pretreament
removes all moisture.  Bill Moffat

________________________________________
From: mems-talk-bounces+bmoffat=yieldengineering.com@memsnet.org [mems-talk-
bounces+bmoffat=yieldengineering.com@memsnet.org] on behalf of Ned Flanders
[howdilydoo@gmail.com]
Sent: Friday, June 10, 2011 9:55 AM
To: General MEMS discussion
Subject: Re: [mems-talk] dicing problem with silicon wafer

I've once patterned the primed surface (some areas had the HMDS
monolayer, others didn't), and even with long periods of sonication in
acetone, the HMDS monolayer would happily stay on. I was very
impressed


m
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