Hello All,

I am attempting to electroplate nickel of 100um thickness on Ti/Au seed
layer. I am using Technic Nickel Sulphamate RTU solution at 45C with 150rpm
magnetic stirring. The pH was monitored to be at 4 and the current density
maintained at 70mA/cm2.

After 2 hours of plating, the stress is huge that it strips from the pyrex
substrate. I have also added 1g/L saccharin but to no use. Can someone give
me some pointers on how to tackle this stress issue.

A link to an optical image of the metal stripping out of the surface and
looking skywards:).

http://www.box.net/shared/nkp95tltba58382laydc

Thanks for your time.
Shree