You probably need to start with a lower current density and then
increase it after a while for a larger plating rate.

Yunda

2011/7/5 Shree Narayanan :
> Hello All,
>
> I am attempting to electroplate nickel of 100um thickness on Ti/Au seed
> layer. I am using Technic Nickel Sulphamate RTU solution at 45C with 150rpm
> magnetic stirring. The pH was monitored to be at 4 and the current density
> maintained at 70mA/cm2.
>
> After 2 hours of plating, the stress is huge that it strips from the pyrex
> substrate. I have also added 1g/L saccharin but to no use. Can someone give
> me some pointers on how to tackle this stress issue.
>
> A link to an optical image of the metal stripping out of the surface and
> looking skywards:).
>
> http://www.box.net/shared/nkp95tltba58382laydc
>
> Thanks for your time.
> Shree

--
Yunda Wang, Ph.D. Candidate
Department of Mechanical engineering
University of Colorado - Boulder
Boulder,Co. US. 80302
(614)3120920
E-mail: yundawang@gmail.com