Hi,

I'd like to use an intermediate material to "bond" device wafer to dummy Si
wafer for dicing. The "bonding" strenth may not be very strong.

The main goals are to reduce chipping on the device wafer during dicing, and
easy to clean at the same time. positive photoresist could be an option..  Does
any one know any material that is suitable for this application? It could be low
cost, not toxicate,  and easy for cleaning

Thanks a lot!