Hi all,

I wanna try lift off process to pattern my Ti layer. My current situation is
that I can use negatvie resist MA405 from Microchem for the sacrifical layer.
However, the thickness of such resist is less than 1um by spin coating whilst my
Ti layer is supposed to be 500nm. Should the sacrifical layer thicker than the
metal on top of it for a lift off process? Can I double or even triple coat this
resist to make a thicker sacrifical layer?

Cheers