Hi all,

I was wondering if someone has experience with
wafer bonding whereby a thin layer of Mo (100nm) will service as
intermediate layer.

Can we bond Mo to Mo or is het better to bond Mo to SiO2?

Many thanks in advance.

Peter Kuijpers
Process Engineer
Philips Innovation Services
MiPlaza/TL group
High Tech Campus 04-p5.12
5656 AE Eindhoven
The Netherlands
Phone: +31 402743667
Mobile:+31 612507027, Mobex: +31 402798904
Email: p.e.m.kuijpers@philips.com