Hi,

Not sure you'll find anything using plasma etch. Average etch rate of glass in
3-4kW ICPs is 0.2-0.3um/min. People had deep etches using a thick electroplatted
Ni mask. Never heard of TGV (thru Glass vias) made by plasma etch, I'm not on
top of the literature though.

Making holes thru glass wafers can be done in several other ways, it all depends
on the size and density of the hole you want to drill:
- ultrasonic drilling (costs is about 200$ per wafer and there an initial
tooling cost to add)
- laser drilling
- manual diamond bit drilling (we do that for process development: time
consuming but cheap and fast to get holes down to 400um in diam)
- HF:HCl wet etch but you'd need a thick aSi hard mask and holes will be pretty
large

HTH

-----------------------------------
Matthieu Nannini
McGill Nanotools Microfab
Manager
t: 514 398 3310
c: 514 758 3311
f: 514 398 8434
http://miam2.physics.mcgill.ca/
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