If you use a pattern with rows of closely spaced holes to evaluate your
etch process, breaking the wafer in a random place will result in a few
good cross sections on any broken edge.  I have a photomask with a
pattern of 5um holes on 30um centers that works well.

Roger Shile

-----Original Message-----
From: mems-talk-bounces+rshile=nanoink.net@memsnet.org
[mailto:mems-talk-bounces+rshile=nanoink.net@memsnet.org] On Behalf Of
ning xue
Sent: Monday, November 07, 2011 8:39 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Cross section view of SEM image

Hi,

I am planing to have a look at the cross section of my deep silicon
etching
sample by SEM. I found that it is really difficult to manually cut the
slicon sample right along the diameter of the etcher hole. Is there any
good way to cut the wafer nicely and the cut side goes through the
center
of etched hole?

Thanks
Ning