Hi Denis,

Since you have plating ability, you can plate your own standards.

I suggest you plate three wafers with three thicknesses of nominally 20% Fe.
Paint resist on the edges (non-uniform areas) of the wafers and on an
analysis spot to be your EDX standard. In separate containers, etch the bulk
of each film in 20 mls. of 50% HNO3. Dilute and measure the Ni/Fe ratio by
A.A. for each sample and convert to %Fe using algebra. Write this % Fe on
the back of each wafer with the corresponding analysis spot for EDX
calibration.

Be aware that EDX is sensitive to thickness for films less than 4-5 um.

It is valuable to make one standard the thickness of your desired sample.

Regards,
Dave


David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391


-----Original Message-----
From: Denis Petrov [mailto:dazeuhl@googlemail.com]
Sent: Wednesday, November 09, 2011 12:59 AM
To: General MEMS discussion
Subject: [mems-talk] Electroplated FeNi Analysis. Calibration Standard

Dear colleagues,

we are about to electroplate 20Fe80Ni layer onto our wafers. We have to
fullfill a very strict spec concearning the percentage of Fe in this layer.
Among other methods, we are going to use an EDX-analyser. But we lack a
calibration standard for 20Fe80Ni alloy.

Could anyone suggest a good and reliable supplier of such standards
(preferrably in Europe, since we will need it very soon)?

Many thanks in advance!

Best regards,

--
Denis Petrov