Hi all,

I am doing some work to evaporate Au to a substrate with some SU-8 bumps. To
cover one of the side walls the sample stage was tilted. I found the electric
connection after Au etching was not consistent. Sometime the electric connection
was good sometimes failed. I am wondering what are the potential causes? Our Au
thickness was 100nm and there was no adhesion layer, Cr or Ti, under gold. Are
these two the culprits - too think gold layer or no adhesion layer? Or there
should be something else I should have taken care of but neglected?

Thank you in advance