Hi,

It is really nice to hear some suggestions from you guys. Mohd, I agree with you
and I observed the same thing. I do not even need to use probes but I can simply
scratch gold off from the SiO2 layer by using my nails effortlessly. My case is
even worse because I have some SU-8 bumps which are not planar structures but
more than 5um high. I need to cover the top and the side walls of the SU-8 bumps
to make electric connections between the  top of SU-8 and the bottom  SiO2. I
will come back to you to report the change but this will take a little bit
longer since our Cr etchant has not arrived yet.

All the best


>________________________________
> From: Mohd.Yusuf 
>To: Shane GUO 
>Sent: Tuesday, December 6, 2011 2:21:50 PM
>Subject: Re: [mems-talk] e-beam evaporation of gold
>
>
>HI,
>
>I am also doing same. Au on si/sio2 substrate without any adhesion layer. my Au
thickness is 100nm. I am using it as contacts for organic field effect
transistor. i see that gold is easily getting scratched by my microprobes when i
try to make contacts. also there is negligible conductivity.
>i also presume that adhesion promotion layer like cr, ti is must. please update
me if you could solve the prob and i will update you if i could get a solution
for this prob.
>
>regards
>yusuf