Hi,

I agree with Brad. Glass behaves really differently than semiconductor: thermal
inertia and transparency are the main properties that will have an effect on
your process parameters. As image reversal processes are sensitive to bake and
exposition, you will need to adjust your process => several runs while playing
with parameters.

Matthieu

Le 2011-12-21 à 12:00, 
 a écrit :

> Message: 1
> Date: Tue, 20 Dec 2011 11:24:10 -0800
> From: Brad Cantos 
> Subject: Re: [mems-talk] Image reversal process on microscope lamel
> To: General MEMS discussion 
> Cc: Selda Sonusen 
> Message-ID: <1F7706B1-2B2D-490F-833D-F01AFD78B2FB@holage.com>
> Content-Type: text/plain; charset=us-ascii
>
> Hi,
>
> You didn't really give a lot of details of your process, so it is difficult to
diagnose specifically.  If you are using a hot plate for baking the resist,
glass takes much longer to heat up than GaAs, so you may not be baking it long
enough.  You should be using an adhesion promoter, so if not, this could also be
a cause of failure.  Since you can do standard positive lithography, it may
depend on your pattern.  Finally, image reversal usually requires a longer
image-wise exposure (with the mask) than positive to make sure that you expose
at the resist/substrate interface.
>
> Brad