Hi

I am looking for somebody who offers wafer polishing as a service.

I am working on the design, development and fabrication of a silicon
based pressure
sensor. In order to make the sensor two processed wafers have to be
bonded by
fusion bonding, of which one of the wafers has to be polished prior to
bonding in
order to planarize the surface. The wafers to be polished are SOI
wafers: 350 um Si/
2000Å SiO2/ 5000 Å Si on which local oxidation has been performed in
such a way
that islands of Si is buried in oxide. The surface is covered with 2000
Å SiO2 with
step heights of around 500 Å.

Regards
Karen Birkelund
--------------------------------------------
Danfoss A/S
Danish Technical University
CAT, Building 347
DK-2800 Lyngby
Denmark

Phone: (+45) 4525 6431 (direct)
Phone: (+45) 4525 6400 (switchboard)
Fax: (+45) 4525 6419