Hi,

I have a structure covered in 100 nm SiO2 which I need to selectively
remove with BOE (using SU8 as a mask).  Beneath the SiO2 there will be
25 - 50 Angstroms of metal.  Any recommendations for which metal to use?
I was thinking Au or Cr, but haven't found any references for whether
and/or how quickly these metals etch in BOE/HF.

Thanks,
Jonathan

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Jonathan J. Sapan 
Graduate Student Researcher
Center for Magnetic Recording Research
University of California at San Diego