durusmail: mems-talk: Au-Au thermo-compression wafer bonding
Au-Au thermo-compression wafer bonding
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Au-Au thermo-compression wafer bonding
Roger Shile
2012-01-17
Domenico,

Please explain how thiol is used in wafer bonding (references?).

Roger Shile

-----Original Message-----
From: mems-talk-bounces+rshile=nanoink.net@memsnet.org
[mailto:mems-talk-bounces+rshile=nanoink.net@memsnet.org] On Behalf Of
domenico.tulli@icfo.es
Sent: Monday, January 16, 2012 3:20 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Au-Au thermo-compression wafer bonding

Why don't you try a thiol? It should work at low temperature without
using  much weight.

Regards.
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