Hi,

I have some questions regarding Futurrex planarization coatings, PC3:

1) Where can I find a dispersion curve or cauchy coefficients for this film?

2) What is a typical RIE etchback recipe for this resist on SiO2 such as
gas composition/ratios, pressure, power, etc?

3) Is it normal to see smoke/vapor when baking these films on a hotplate at
200C,
the recommended temp in the datasheet)?

4) Does the baking temperature have any effect on the selectivity to SiO2?

5) Can anyone recommend other planarization coatings for etch back?

Thanks!

John-Rolf