During my work, I've been using a thiol (dodecanthiol, hexanthiol...) to
bond two films (around 100nm) of Au deposited on glass. After forming a
SAM (self assembled monolayer), I put a weight on top of my samples and
left them in a oven for several hours at a temperature around 200ºC.
I tested the strength of the bonding by lapping and dicing the samples
and it worked.

Hope this help.
Best.

Domenico.

On 17/01/2012 22:15, Roger Shile wrote:
> Domenico,
>
> Please explain how thiol is used in wafer bonding (references?).
>
> Roger Shile

--
Domenico Tulli
Nano Photonics-Optoelectronics Group

ICFO-The Institute of Photonic Sciences
Mediterranean Technology Park
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