durusmail: mems-talk: Surplus 4inch/100mm SOI Wafers Available
Surplus 4inch/100mm SOI Wafers Available
2012-01-20
Surplus 4inch/100mm SOI Wafers Available
Napp Jones
2012-01-20
Hello All,

We have got some surplus good quality 4inch/100mm SOI wafers for re-sale.
You can find their specs below. Please let us know immediately if you are
interested in buying these in full or part. We will offer you the best
price, much better than what we paid for them from the commercial wafer
vendor. If you are interested, the wafer history is also available.

Regards,

Napp Jones


* Read -- um => micron
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1. 1.5 um SOI wafers (SOITEC) - suitable for IC & MEMS
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* Available Quantity - 12x pcs

* Orientation - (100)

* Device Silicon Layer - Thickness/Type/Resistivity:
  1.5 um/P-type (B)/14-18 ohm-cm

* Oxide (BOX) Layer Thickness - 1.0 um

* Handle Silicon Layer - Thickness/Type/Resistivity:
  400 um/N-type(Ph)/0.3-1.2 ohm-cm

* Double-side Polished (DSP): Yes

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2.  3 um SOI wafer - suitable for MEMS
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* Available Quantity - 1x pcs

* Orientation - (100)

* Device Silicon Layer - Thickness/Type/Resistivity:
  3.0 um/P-Type(B)/4-6 ohm-cm

* Oxide (BOX) Layer Thickness - 1.0 um

* Handle Silicon Layer - Thickness/Type/Resistivity:
  ~500.0 um/P-type(B)/na

* Double-side Polished (DSP): No

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3. 25 um SOI wafer (Ultrasil) - suitable for MEMS
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* Available Quantity - 1x pcs

* Orientation - (100)

* Device Silicon Layer - Thickness/Type/Resistivity:
  25 um +|- 0.5 um/P-Type(B)/0.02-0.05 ohm-cm

* Oxide (BOX) Layer Thickness - 3.0 um

* Handle Silicon Layer - Thickness/Type/Resistivity:
  465.0 um +|- 5.0 um/P-Type(B)/0.01-0.02 ohm-cm

* Double-side Polished (DSP): Yes

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4. 27.5 um SOI wafer (Ultrasil) - suitable for MEMS
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* Available Quantity - 1x pcs

* Orientation - (100)

* Device Silicon Layer - Thickness/Type/Resistivity:
  25um +|- 0.5 um, P-Type(B)- 2.0um, N-Type(As) - 0.5 um, P-Type(B)/<0.05
ohm-cm

* Oxide (BOX) Layer Thickness - 3.0 um

* Handle Silicon Layer - Thickness/Type/Resistivity:
  465.0 um +|- 5.0 um/P-Type(B)/0.01-0.02 ohm-cm

* Double-side Polished (DSP): Yes

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5. 47 um +/- 3 um SOI wafers (Ultrasil) - suitable for MEMS
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* Available Quantity - 2x pcs

* Orientation - (100)

* Device Silicon Layer - Thickness/Type/Resistivity:
  47.0 um +|- 3.0 um/P-Type(B)/<0.05 ohm-cm

* Oxide (BOX) Layer Thickness: 2.0 um

* Handle Silicon Layer - Thickness/Type/Resistivity:
  300.0 um/P-Type(B)/<0.05 ohm-cm

* Double-side Polished (DSP): Yes

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