Hi,

I'm about to start a process to make thin cantilevers (100nm thick, 1 to 4um
wide, 10 to 25um long) out if an SOI wafer with a 350nm BOX layer. I have a CPD
for the final drying step but I still have some doubts it's going to work
(stiction). Anyone have experience with such processes ?

Thanks
Matthieu Nannini