Mathieu,
                    A standard process to remove stiction is to treat the
cantilevers in a system that totally dehydrates then coats everywhere with a
monolayer typically 5 Angstroms thick of reactive material that changes contact
angle and produces a totally hydrophobic surface.  Typical contact angles of 130
degrees, Teflon is 120.  We can do free samples for you please contact me.

Bill Moffat

-----Original Message-----
From: mems-talk-bounces+bmoffat=yieldengineering.com@memsnet.org [mailto:mems-
talk-bounces+bmoffat=yieldengineering.com@memsnet.org] On Behalf Of Matthieu
Nannini, Dr.
Sent: Monday, January 30, 2012 7:26 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] releasing cantilever with thin SOI

Hi,

I'm about to start a process to make thin cantilevers (100nm thick, 1 to 4um
wide, 10 to 25um long) out if an SOI wafer with a 350nm BOX layer. I have a CPD
for the final drying step but I still have some doubts it's going to work
(stiction). Anyone have experience with such processes ?

Thanks
Matthieu Nannini