We are looking for someone with capability to do double-sided exposure of a few
6" wafers for some preliminary tests.

Does anyone out there have equipment to do this? If so, what are your alignment
accuracy and minimum feature size?

Thanks,
Leslie
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 ************* __  *************   Leslie Field
***********   / /    ************  Project Leader - Micromechanics
*********    / /        *********  Solid-State Technology Laboratory
*******     / /___ ______ *******  Hewlett-Packard Laboratories
******     / __  // __  /  ******  email: field@hpl.hp.com
******    / / / // /_/ /   ******  US Mail: 3500 Deer Creek Road
*******  /_/ /_// ____/   *******           Building 26M-2
********       / /      *********           Palo Alto, CA 94304
**********    / /     ***********  Phone:   (415) 857-5042
 *********** /_/ ***************   Fax:     (415) 852-8626