Dear All,
I'm trying to use DRIE made silicon mold for hot-embossing.  I think there
are two potential problems:
1. Straight or undercut sidewall will make de-molding process in hot-emboss
difficult. I need to get 1 to 2 degree tapered side wall. Any good receipt
for Bosch process developed in Alcatel AMS 100?
2. *Scalloped* sidewall from Bosch process may prevent the plastic parts
de-molded from silicon mold. It seems a TMAH etching will smooth the
surface. Anyone has receipt or anyone can access this paper?
http://adsabs.harvard.edu/abs/2007IJTSM.127..187P
Many Thanks!
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