Hello

We've been struggling with particles getting embedded in our delicate
silicon comb structures during dicing. Our current process involves
spraying on a 10um thick layer of photoresist over the entire wafer and
then do a soft bake. After dicing we rinse the wafer to remove particles
before stripping off the resist. However we're still getting particles
stuck in-between the comb fingers. We've attempted ultrasonic cleaning but
that damages the combs.

Any tips to remove or prevent particles would be greatly appreciated.

Thank you
Kevin Chang
ProtoSi
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