Hi Kevin, You can reduce the particle problem even more if you put the wafer between two layers of sticky foil after the softbake regards Carel Heerkens -----Original Message----- From: mems-talk-bounces+c.t.h.heerkens=tudelft.nl@memsnet.org [mailto:mems-talk- bounces+c.t.h.heerkens=tudelft.nl@memsnet.org] On Behalf Of ProtoSi Info Sent: dinsdag 24 juli 2012 21:22 To: mems-talk@memsnet.org Subject: [mems-talk] dicing particle contamination Hello We've been struggling with particles getting embedded in our delicate silicon comb structures during dicing. Our current process involves spraying on a 10um thick layer of photoresist over the entire wafer and then do a soft bake. After dicing we rinse the wafer to remove particles before stripping off the resist. However we're still getting particles stuck in-between the comb fingers. We've attempted ultrasonic cleaning but that damages the combs. Any tips to remove or prevent particles would be greatly appreciated. Thank you Kevin Chang ProtoSi _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk