Hi All, I am trying to do a double-layer SU8 50 process. Both layers are rather thick, i.e. more than 250 um. I finished the first layer by following the recommended recipe and, as suggested by some researchers, I only did a short post exposure bake at 70 C to form a weak crosslink. The first layer was finished nicely and no visible crack was spotted. Then, I spun coating the second layer SU8 and left it resting for few hours before sofe bake. However, after leaving the second layer SU8 for few hours, I found lots of cracks occurred in the first layer. I was able to complete the process and the crack did not cause substantial damage to the structure so far. But, I still don't think it's a good sign for the quality of the structure. Anybody has an idea how these cracks occurred in the first layer? Thanks, Yingtao _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk