this may help:

http://microchem.com/su_eight_faq.htm

Happy Holidays


2012/12/20 Gareth Jenkins :
> Perhaps try covering the wafer in the resist solvent before pouring the
> resist? This may help fill the gaps.
>
> On 21 December 2012 02:57, João Tiago dos Santos Fernandes <
> jfernandes@inesc-mn.pt> wrote:
>
>> Hi everyone,
>>
>> I'm currently using AZ 40XT thick photoresist to make a 20-30 µm thin film
>> over a Si sample with ~30 µm high SU-8 features.
>>
>> The problem I am facing is the following: when I pour the AZ on top of the
>> sample, tiny air-bubbles are created in areas where SU-8 features are small
>> (small wells, gaps, etc) - I'm guessing that this happens because the AZ is
>> very viscous and isn't able to fill those spaces and traps air. When I spin
>> coat, those tiny air bubbles are spread across the sample, compromising the
>> process.
>>
>> Is there any way to get the air bubbles out of the way without
>> compromising the final film thickness? I tried low rpm for a couple of
>> minutes, with no success.
>>
>> Thank you so much,
>>
>> -----------------------------
>> João Tiago dos Santos Fernandes
>>
>> INESC Microsistemas e Nanotecnologias (INESC MN)
>> Rua Alves Redol, 9
>> 1000-029 Lisboa
>> Portugal
>>
>> Tel: +351 213100237
>> Email: jfernandes@inesc-mn.pt
>> URL: www.inesc-mn.pt
>>
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