I dice 4" Si wafers with diamond/resin blades all the time, but you need to
use the appropriate blade, chuck, spindle speed, feed rate, etc. for the
material you're dicing.  The optimal conditions for dicing Pyrex are
probably different from the optimal conditions for dicing Si.  I suggest
checking with the manufacturer of your dicing saw and/or blades for their
recommendation.

Good luck,

Brian

--
Brian C. Stahl
Graduate Student Researcher
UCSB Materials Research Laboratory



On Wed, Jan 30, 2013 at 8:52 AM, Emre Olceroglu wrote:

> Hello,
>
> I was wondering if I can dice 0.5mm silicon wafers with diamond blades
> that we normally use for Pyrex dicing.
>
> I know people dice bonded Silicon-Pyrex but I am not sure which blade they
> use.
>
> Thanks.
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