Dear Rajiv,

Have you tried Remover PG (at 65C) to strip SU8? Or maybe you can prime your
wafer with Omnicoat, it will ensure that SU8 to be stripped off easier.

Best Regards,
Jocelyn

On 21 Feb, 2013, at 16:39, Rajiv Panigrahi  wrote:

> Dear all,
>      I am using SU-8 (2150), a negative photo resist for ultra thickness.
> But during development it takes lot of time, likely 24 hour. May i know the
> procedure how to develop to it as conventional ways. How do i striping out
> SU- 8, with out affecting metal part of substrate.(I mean with out
> introducing piranha cleaning).
> --
> With Best Regard,
>
> Rajiv Panigrahi
> Research Scholar
> CeNSE, IISc, Bangalore (India)
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